Assessing Benefits of a Buried Interconnect Layer in Digital Designs
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چکیده
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ژورنال
عنوان ژورنال: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
سال: 2017
ISSN: 0278-0070,1937-4151
DOI: 10.1109/tcad.2016.2572144